The development of the semiconductor industry is not achieved overnight. It is built on a series of huge technological leaps, continuously improving year after year, and its speed may be faster than any other industry in history.
 

In terms of logic chips: TSMC's N2 process, Samsung and other companies' 2D material technology, advances in CFET, and Intel's unprecedented expansion of silicon channels. The expert group stated that although significant progress has been made at the conference, it is still not enough to keep up with the pace of artificial intelligence development.
 

In terms of memory technology, one focus is on memory computing, which is a potential long-term solution to address the memory bottleneck of artificial intelligence. Meta showcased an innovative 3D stacked memory technology. Advanced packaging technology has attracted widespread attention. There is ample reason for this, as packaging technology is now a key pathway to drive computing power expansion - we will explore Intel's new EMIB-T2.5D technology and TSMC's next-generation SoIC3D hybrid bonding products.