Everspin Technologies, Inc.Headquartered in Chandler, Arizona, Everspin Technologies, Inc. is the worldwide leader in designing, manufacturing, and commercially shipping discrete and embedded Magnetoresistive RAM (MRAM) and Spin-Torque MRAM (ST-MRAM) into markets and applications where data persistence and integrity, low latency, and security are paramount.  With over 50 Million MRAM and ST-MRAM products deployed in data center, cloud storage, energy, industrial, automotive, and transportation markets, Everspin has built the strongest and fastest growing foundation of MRAM users in the world.
     A die in the context of integrated circuits is a small block of semiconducting material, on which a given functional circuit is fabricated. Typically, integrated circuits are produced in large batches on a single wafer of electronic-grade silicon (EGS) or other semiconductor (such as GaAs) through processes such as photolithography. The wafer is cut (“diced”) into many pieces, each containing one copy of the circuit. Each of these pieces is called a die.
    Shenzhen Ramsun Micro-electronincs Co., Ltd was authorized as Everspin's Die Sales Distributor.
The following is the Everspin's Die part number:

category	Density	Org.	P/N
MRAM	1Mb	x8	MR0A08B
MRAM	1Mb	x8	MR2A08A
MRAM	1Mb	x16	MR2A16A
MRAM	16Mb	x8	MR4A08B
MRAM	16Mb	x16	MR4A16B
SPI MRAM	1Mb	--	MR25H10
SPI MRAM	4Mb	--	MR25H40